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Physics-Informed and AI-Driven Materials and Manufacturing



Atomistic study of self-diffusion in Ni, Al and Ni3Al


Conference paper


J. Duan, Y. N. Osetsky, D. J. Bacon
Defect and Diffusion Forum, vol. 194, Trans Tech Publ, 2001, pp. 423--428

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Cite

APA   Click to copy
Duan, J., Osetsky, Y. N., & Bacon, D. J. (2001). Atomistic study of self-diffusion in Ni, Al and Ni3Al. In Defect and Diffusion Forum (Vol. 194, pp. 423–428). Trans Tech Publ.


Chicago/Turabian   Click to copy
Duan, J., Y. N. Osetsky, and D. J. Bacon. “Atomistic Study of Self-Diffusion in Ni, Al and Ni3Al.” In Defect and Diffusion Forum, 194:423–428. Trans Tech Publ, 2001.


MLA   Click to copy
Duan, J., et al. “Atomistic Study of Self-Diffusion in Ni, Al and Ni3Al.” Defect and Diffusion Forum, vol. 194, Trans Tech Publ, 2001, pp. 423–28.


BibTeX   Click to copy

@inproceedings{duan2001a,
  title = {Atomistic study of self-diffusion in Ni, Al and Ni3Al},
  year = {2001},
  organization = {Trans Tech Publ},
  pages = {423--428},
  volume = {194},
  author = {Duan, J. and Osetsky, Y. N. and Bacon, D. J.},
  booktitle = {Defect and Diffusion Forum}
}


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